System Requirements
- Microsoft® Windows® 7, Windows® 8 or Windows® 10
- 1GHz Intel®/AMD processor or above
- 512MB RAM or more
- 50MB free hard disk space for installation
- Super VGA (800 x 600) resolution, 16-bit graphics card or higher
Curing Simulation
The curing system of thermoset resins are exothermic and curing reactions usually take place at temperatures higher than environment temperature. The heat of reaction causes a temperature peak in the curing system that the size and width of the peak depends on several factors. The best curing system is when we see the most uniform peak. Various intrinsic and environmental parameters affect curing system of these systems. MeasSoft provies a simple and practical software that by using it you can observe the effect of different parameters (density, thermal conductivity, heat capacity, curing temperature, system size and etc) on the curing systems. This software simulate the curing system and temperature changes of resins in a cylindrical mold during curing reactions. Please see the video and our article "Thermal Kinetics of Polymers. Part II: Curing Simulation" and contact us by Info@MeasSoft.com
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